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Investigation of Breakdown Behaviour and Improvement of Spatial Resolution for Silicon Pixel Detectors

dc.contributor.advisorDingfelder, Jochen
dc.contributor.authorZhang, Sinuo
dc.date.accessioned2025-07-07T08:04:11Z
dc.date.available2025-07-07T08:04:11Z
dc.date.issued07.07.2025
dc.identifier.urihttps://hdl.handle.net/20.500.11811/13186
dc.description.abstractIn high-energy physics, the demand for silicon pixel detectors is increasing due to the elevated particle collision rates in collider experiments, since silicon detectors can handle high particle fluxes and provide precise determination of particle tracks. Silicon pixel sensors fabricated using commercial CMOS technologies (passive CMOS sensors) offer an attractive alternative to conventional planar pixel sensors. Commercial CMOS technologies provide a well-tuned set of fabrication parameters and special features, such as multiple metal layers, ensuring the reliability of the final products. However, this advantage comes at the cost of limited customisability for doping profiles, making it difficult to transfer previous knowledge from planar sensors directly. The studies presented in this work focus on two crucial features of passive CMOS silicon pixel sensors: breakdown performance and spatial resolution. The breakdown voltage determines the upper limit of the operational voltage of silicon pixel detectors. It is influenced by the design of the implant structures in the area between the pixel matrix and the chip’s edge, where a large voltage drop occurs. The goal of optimising the sensor design is to provide a smooth potential drop to suppress unexpected high electric fields. N-on-p passive-CMOS test structures were fabricated, measured, and simulated using TCAD to study the relationship between guard ring design and breakdown performance. In the second part of the thesis, a concept for improving spatial resolution using directional charge sharing between pixels is proposed and validated through dedicated simulations. Directional charge sharing can be achieved via subdivision of pixels and capacitive cross-couplings, which can be realised using commercial CMOS technologies. Results show an improvement in spatial resolution of approximately 30% compared to conventional pixel sensors with the same pitch size.en
dc.language.isoeng
dc.rightsNamensnennung 4.0 International
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/
dc.subjectSilizium Pixeldetektoren
dc.subjectDurchbruchspannung
dc.subjectSchutzringe
dc.subjectOrtsauflösung
dc.subjectpassive CMOS
dc.subjectTCAD Simulation
dc.subjectsilicon particle detector
dc.subjectbreakdown voltage
dc.subjectguard rings
dc.subjectspatial resolution
dc.subjectpassive CMOS
dc.subjectTCAD simulation
dc.subject.ddc530 Physik
dc.titleInvestigation of Breakdown Behaviour and Improvement of Spatial Resolution for Silicon Pixel Detectors
dc.typeDissertation oder Habilitation
dc.identifier.doihttps://doi.org/10.48565/bonndoc-592
dc.publisher.nameUniversitäts- und Landesbibliothek Bonn
dc.publisher.locationBonn
dc.rights.accessRightsopenAccess
dc.identifier.urnhttps://nbn-resolving.org/urn:nbn:de:hbz:5-83327
dc.relation.doihttps://doi.org/10.1016/j.nima.2020.164524
dc.relation.doihttps://doi.org/10.1016/j.nima.2024.169287
ulbbn.pubtypeErstveröffentlichung
ulbbnediss.affiliation.nameRheinische Friedrich-Wilhelms-Universität Bonn
ulbbnediss.affiliation.locationBonn
ulbbnediss.thesis.levelDissertation
ulbbnediss.dissID8332
ulbbnediss.date.accepted15.04.2025
ulbbnediss.instituteMathematisch-Naturwissenschaftliche Fakultät : Fachgruppe Physik/Astronomie / Physikalisches Institut (PI)
ulbbnediss.fakultaetMathematisch-Naturwissenschaftliche Fakultät
dc.contributor.coRefereeDesch, Klaus
ulbbnediss.contributor.orcidhttps://orcid.org/0009-0009-5083-7857


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